Thermodynamic Assessment of Sn-Co-Cu Lead-free Solder Alloy
Paper in proceedings, 2003

Author

Libin Liu

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Y C Chan

Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition

2003-35126

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/8/2017