Low Cycle Fatigue of Sn-based Lead-free Solder joints and the analysis of fatigue life prediction uncertainty
Paper in proceeding, 2006

Author

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Peng Sun

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06)

19-26

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017