Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
Paper in proceedings, 2006

Author

Peng Sun

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Dag R Andersson

Per-Erik Tegehall

Dongkai Shangguan

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology

760-767

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017