Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal ccling testing
Paper in proceeding, 2006
Author
Peng Sun
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2)
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Dag R Andersson
Per-Erik Tegehall
Dongkai Shangguan
Proceedings of the 2006 7th International Conference on Electronics Packaging Technology
760-767
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering