Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Journal article, 2008
Author
Xiangdong Zou
Yulai Gao
Qijie Zhai
Cristina Andersson
Chalmers, Applied Physics, Electronics Material and Systems
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Journal of Electronics Materials
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering