Nanoparticles of the Lead-free Solder Alloy Sn-3.0Ag-0.5Cu with Large Melting Temperature Depression
Journal article, 2008

Author

Xiangdong Zou

Yulai Gao

Qijie Zhai

Cristina Andersson

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Journal of Electronics Materials

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Latest update

12/13/2018