Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper in proceeding, 2006
Author
Suresh Chand Verma
Wanbing Guan
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2)
Yulai Gao
Qijie Zhai
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006)
282-286
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering