Flip-Chip Interconnection Using Anisotropic Conductive Adhesive with Lead Free Nano-Solder Particles
Paper in proceedings, 2006

Author

Suresh Chand Verma

Wanbing Guan

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2)

Yulai Gao

Qijie Zhai

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 1st IEEE CPMT Electronics Systemintegration Technology Conference (ESTC2006)

282-286

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017