Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Paper in proceeding, 2008
Author
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Cristina Andersson
Yulai Gao
Qijie Zhai
Proceedings of the IEEE 10th Electronics Packaging Technology Conference
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering