Recent Development of Nano-solder Paste for Electronics Interconnect Applications
Paper in proceedings, 2008

Author

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Cristina Andersson

Yulai Gao

Qijie Zhai

Proceedings of the IEEE 10th Electronics Packaging Technology Conference

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017