Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components
Paper in proceedings, 2004

Author

Cristina Andersson

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Dag R. Andersson

Per-Erik Tegehall

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE)

Vol. May 10th to 12th pp 455-464

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017