Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components
Paper in proceeding, 2004
Author
Cristina Andersson
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Dag R. Andersson
Per-Erik Tegehall
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems (EuroSimE)
Vol. May 10th to 12th pp 455-464
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering