Characterization of nano-enhanced interconnect materials for fine pitch assembly
Journal article, 2014

Purpose - Multiple fillers are adopted to study the filler influences on electrical and mechanical properties of the conductive adhesives. The performances of the developed nano-enhanced interconnect materials in printing process are also evaluated. The paper aims to discuss these issues. Design/methodology/approach - Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives with multiple fillers. Differential scanning calorimetry measurement is carried out to characterize the curing behavior of the samples with different fillers, four-probe method is used to obtain the bulk resistivity, shear test is conducted for adhesive strength, and environmental loading test is also involved. Furthermore, printing trials with different patterns have been carried out. Findings -The electrical resistivity of the adhesives with submicro-sized silver spheres does not monotonically change with the increasing sphere proportion, and there exists an optimized value for the ratio of silver flakes to spheres. Samples with relatively small amount of CNT additives show improved electrical properties, while their mechanical strengths tend to decrease. For the printing application, the adhesives with 18.3 volume% filler content behave much better than those with lower filler content of 6 percent. The presence of the nano-particles makes a slight improvement in the printing results. Research limitations/implications - More detailed printing performance and reliability test of the samples need to be carried out in the future. Originality/value - The conductive adhesives as interconnect materials exhibit some improved properties with optimized bimodal or trimodal fillers. The additive of the nano-fillers affects slightly on the printing quality of the bimodal conductive adhesives.


Conductive adhesives

Nano-Ag paste


Flexible PCBs


Y. Zhang

Shanghai University

J. Sitek

Instytut Tele-i Radiotechniczny, Warszawa

J. Fan

Shanghai University

S. Ma

Shanghai University

M. Koscielski

Instytut Tele-i Radiotechniczny, Warszawa

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Soldering and Surface Mount Technology

0954-0911 (ISSN) 17586836 (eISSN)

Vol. 26 1 12-17 17104193

Subject Categories

Materials Engineering

Metallurgy and Metallic Materials



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