Heat transfer simulation of nanofluids in microfluidic channels
Paper in proceedings, 2008

Author

Hongjun Liu

X Wang

Minliang Zhang

Wen Zhang

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Other publications Research

Proceedings of the 2008 International Conference on Electronics Packaging Technology &　High Density Packaging

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/7/2017

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