Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers
Paper in proceedings, 2011

Author

M. Inoue

H. Muta

S. Yamanaka

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15

941 - 946

Areas of Advance

Nanoscience and Nanotechnology

Materials Science

Subject Categories

Materials Engineering

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017