Electrical and thermal conductivities of thermally conductive adhesives composed of a multi-functional epoxy resin containing Ag-plated Cu fillers
Paper in proceeding, 2011
Author
M. Inoue
H. Muta
S. Yamanaka
Johan Liu
Chalmers, Applied Physics, Electronics Material and Systems
Proceedings of the International Conference on Electronics Packaging (ICEP), Japan, Nara 2011 April 13-15
941 - 946
Areas of Advance
Nanoscience and Nanotechnology
Materials Science
Subject Categories
Materials Engineering
Electrical Engineering, Electronic Engineering, Information Engineering