Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Paper in proceeding, 2019
orientation
thermal management
electrical resistvity
die attach
PVP/BN composite film
Author
Ya Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Fudan University
Nan Wang
SHT Smart High-Tech
L. Ye
SHT Smart High-Tech
Abdelhafid Zehri
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Andreas Nylander
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Amos Nkansah
SHT Smart High-Tech
Hongbin Lu
Fudan University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019
1-5 8760352
Lyngby, Denmark,
Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)
European Commission (EC) (EC/H2020/690896), 2016-01-01 -- 2018-12-31.
Carbon Based High Speed 3D GaN Electronics System
Swedish Foundation for Strategic Research (SSF) (SE13-0061), 2014-03-01 -- 2019-06-30.
Enhanced cement based coating materials for surface protection/repair applications using 2-dimentional materials
Formas (FR-2017/0009), 2018-01-01 -- 2020-12-31.
Subject Categories
Polymer Chemistry
Textile, Rubber and Polymeric Materials
Materials Chemistry
DOI
10.23919/NORDPAC.2019.8760352