Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader
Paper in proceedings, 2019

Thermally conductive materials with electrically insulating properties have been extensively investigated for thermal management of electronic devices. The combined properties of high thermal conductivity, structural stability, corrosion resistance and electric resistivity make hexagonal boron nitride (h-BN) a promising candidate for this purpose. Theoretical studies have revealed that h-BN has a high in-plane thermal conductivity up to 400-800 W m-1 K-1 at room temperature. However, it is still a big challenge to achieve high thermally conductive h-BN thick films that are commercially feasible due to its poor mechanical properties. On the other hand, many polymers exhibit advantages for flexibility. Thus, combining the merits of polymer and the high thermal conductivity of h-BN particles is considered as a promising solution for this issue. In this work, orientated PVP/h-BN films were prepared by electrospinning and a subsequent mechanical pressing process. With the optimized h-BN loading, a PVP/h-BN composite film with up to 22 W m-1 K-1 and 0.485 W m-1 K-1 for in-plane and through-plane thermal conductivity can be achieved, respectively. We believe this work can help accelerate the development of h-BN for thermal management applications.

orientation

thermal management

electrical resistvity

die attach

PVP/BN composite film

Author

Ya Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Fudan University

Nan Wang

SHT Smart High-Tech

L. Ye

SHT Smart High-Tech

Abdelhafid Zehri

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Andreas Nylander

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Amos Nkansah

SHT Smart High-Tech

Hongbin Lu

Fudan University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shanghai University

Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019

1-5 8760352

2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019
Lyngby, Denmark,

Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)

European Commission (Horizon 2020), 2016-01-01 -- 2018-12-31.

Carbon Based High Speed 3D GaN Electronics System

Swedish Foundation for Strategic Research (SSF), 2014-03-01 -- 2019-06-30.

Enhanced cement based coating materials for surface protection/repair applications using 2-dimentional materials

Formas, 2018-01-01 -- 2020-12-31.

Subject Categories

Polymer Chemistry

Textile, Rubber and Polymeric Materials

Materials Chemistry

DOI

10.23919/NORDPAC.2019.8760352

More information

Latest update

3/30/2020