Andreas Nylander

Senior Research Engineer at Quantum Technology

Source: chalmers.se
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Showing 23 publications

2024

Signal Crosstalk in a Flip-Chip Quantum Processor

Sandoko Kosen, Hangxi Li, Marcus Rommel et al
PRX Quantum. Vol. 5 (3)
Journal article
2023

Experimentally Verified, Fast Analytic, and Numerical Design of Superconducting Resonators in Flip-Chip Architectures

Hangxi Li, Daryoush Shiri, Sandoko Kosen et al
IEEE Transactions on Quantum Engineering. Vol. 4
Journal article
2022

Graphene Oxide and Nitrogen-Doped Graphene Coated Copper Nanoparticles in Water-Based Nanofluids for Thermal Management in Electronics

Abdelhafid Zehri, Andreas Nylander, Torbjörn Nilsson et al
JOURNAL OF NANOFLUIDS. Vol. 11 (1), p. 125-134
Journal article
2021

Degradation of Carbon Nanotube Array Thermal Interface Materials through Thermal Aging: Effects of Bonding, Array Height, and Catalyst Oxidation

Andreas Nylander, Josef Hansson, Torbjörn Nilsson et al
ACS Applied Materials & Interfaces. Vol. 13 (26), p. 30992-31000
Journal article
2020

Multiple growth of graphene from a pre-dissolved carbon source

Andrea Fazi, Andreas Nylander, Abdelhafid Zehri et al
Nanotechnology. Vol. 31 (34), p. 345601-
Journal article
2020

High porosity and light weight graphene foam heat sink and phase change material container for thermal management

Abdelhafid Zehri, Majid Kabiri Samani, Martí Gutierrez Latorre et al
Nanotechnology. Vol. 31 (42)
Journal article
2020

Bipolar electrochemical capacitors using double-sided carbon nanotubes on graphite electrodes

Josef Hansson, Qi Li, Anderson David Smith et al
Journal of Power Sources. Vol. 451
Journal article
2020

Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding

Josef Hansson, Andreas Nylander, Mattias Flygare et al
Nanotechnology. Vol. 31 (45)
Journal article
2019

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Ya Liu, Nan Wang, L. Ye et al
Advancing Microelectronics. Vol. 2019 (NOR), p. 1-5
Journal article
2019

Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers

Andreas Nylander, Yifeng Fu, Mingliang Huang et al
IEEE Transactions on Components, Packaging and Manufacturing Technology. Vol. 9 (3), p. 427-433
Journal article
2019

Thermally Conductive and Electrically Insulating PVP/Boron Nitride Composite Films for Heat Spreader

Ya Liu, Nan Wang, L. Ye et al
Proceedings - 2019 IMAPS Nordic Conference on Microelectronics Packaging, NORDPAC 2019, p. 1-5
Paper in proceeding
2019

Graphene-coated copper nanoparticles for thermal conductivity enhancement in water-based nanofluid

Abdelhafid Zehri, Andreas Nylander, L. Ye et al
2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
Paper in proceeding
2019

RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits

Andreas Nylander, Marlene Bonmann, Andrei Vorobiev et al
2019 IEEE 14th Nanotechnology Materials and Devices Conference, NMDC 2019
Paper in proceeding
2019

Reliability investigation of a carbon nanotube array thermal interface material

Andreas Nylander, Josef Hansson, Majid Kabiri Samani et al
Energies. Vol. 12 (11)
Journal article
2018

Thermal Reliability Study of Polymer Bonded Carbon Nanotube Array Thermal Interface Materials

Andreas Nylander, Christian Chandra Darmawan, Ana Borta Boyon et al
THERMINIC 2018 - 24th International Workshop on Thermal Investigations of ICs and Systems, Proceedings
Paper in proceeding
2018

Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications

Josef Hansson, Majid Kabiri Samani, Andreas Nylander et al
Proceedings - Electronic Components and Technology Conference. Vol. 2018-May
Paper in proceeding
2017

Thermal Conductivity Enhancement of Coaxial Carbon@Boron Nitride Nanotube Arrays

Lin Jing, Kabir Majid Samani, B. Liu et al
ACS Applied Materials & Interfaces. Vol. 9 (17), p. 14555-14560
Journal article
2017

Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications

ANDREAS NYLANDER, Yifeng Fu, L. Ye et al
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), p. 175-181
Paper in proceeding
2016

Embedded Fin-Like Metal/CNT Hybrid Structures for Flexible and Transparent Conductors

Di Jiang, Nan Wang, Michael Edwards et al
Small. Vol. 12 (11), p. 1521-1526
Journal article
2016

Development of bulk-nanostructuring methods for BiSbTe Thermoelectric

ANDREAS NYLANDER, Nikolaos Logothetis, Johan Liu
IMAPS Nordic Annual Conference 2016 Proceedings
Paper in proceeding

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