RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits
Paper in proceeding, 2019
Carbon nanotube/copper composite through silicon vias
3D integration
RF measurement
Author
Andreas Nylander
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Marlene Bonmann
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Andrei Vorobiev
Chalmers, Microtechnology and Nanoscience (MC2), Terahertz and Millimetre Wave Laboratory
Josef Hansson
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Nan Wang
SHT Smart High-Tech
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2019 IEEE 14th Nanotechnology Materials and Devices Conference, NMDC 2019
9084012
978-1-7281-2637-1 (ISBN)
Stockholm, Sweden,
Subject Categories
Materials Engineering
Nano Technology
DOI
10.1109/NMDC47361.2019.9084012