Fundamental Characterization of Low Dimensional Carbon Nanomaterials for 3D Electronics Packaging
Doctoral thesis, 2021
The international roadmap of devices and systems (IRDS) highlights the need for improved materials to remove bottlenecks in contemporary as well as future systems in terms of thermal dissipation and interconnect performance. For this very purpose, low dimensional carbon nanomaterials such as graphene and carbon nanotubes (CNTs) are suggested as potential candidates due to their superior thermal, electrical and mechanical properties. Therefore, a successful implementation of these materials will ensure a continued performance to cost development of IC devices.
This thesis presents a research study on some fundamental materials growth and reliability aspects of low dimensional carbon based thermal interface materials (TIMs) and interconnects for electronics packaging applications. Novel TIMs and interconnects based on CNT arrays and graphene are fabricated and investigated for their thermal resistance contributions as well electrical performance. The materials are studied and optimized with the support of chemical and structural characterization. Furthermore, a reliability study was performed which found delamination issues in CNT array TIMs due to high strains from thermal expansion mismatches. This study concludes that CNT length is an important factor when designing CNT based systems and the results show that by further interface engineering, reliability can be substantially improved with maintained thermal dissipation and electrical performance. Additionally, a heat treatment study was made that enables improvement of the bulk crystallinity of the materials which will enable even better performance in future applications.
Electrical interconnects. Thermal interface material
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory
Current status and progress of organic functionalization of CNT based thermal interface materials for electronics cooling applications
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac),; (2017)p. 175-181
Paper in proceeding
Covalent anchoring of carbon nanotube-based thermal interface materials using epoxy-silane monolayers
IEEE Transactions on Components, Packaging and Manufacturing Technology,; Vol. 9(2019)p. 427-433
Reliability investigation of a carbon nanotube array thermal interface material
Energies,; Vol. 12(2019)
Synthesis of a Graphene Carbon Nanotube Hybrid Film by Joule Self-heating CVD for Thermal Applications
Proceedings of 2018 IEEE 68th Electronic Components and Technology Conference (ECTC),; (2018)
Paper in proceeding
Nylander, A. Hansson, J. Nilsson, T. Ye, L. Fu, Y and Liu, J. Degradation of Carbon Nanotube Array Thermal Interface Materials Through Thermal Aging: Eects of Bonding, Array Height and Catalyst Oxidation
Multiple growth of graphene from a pre-dissolved carbon source
Nanotechnology,; Vol. 31(2020)p. 345601-
RF properties of carbon nanotube / Copper composite through silicon via based CPW structure for 3D integrated circuits
2019 IEEE 14th Nanotechnology Materials and Devices Conference, NMDC 2019,; (2019)
Paper in proceeding
Effects of high temperature treatment of carbon nanotube arrays on graphite: increased crystallinity, anchoring and inter-tube bonding
Nanotechnology,; Vol. 31(2020)
Low dimensional carbon nanomaterials are extensively researched for their impressive mechanical, thermal, and electrical properties. For this reason, graphene and carbon nanotubes have been suggested for use in microelectronic devices where they could remove thermal and electrical bottlenecks, and in turn, facilitate 3D packaging for consumer devices. In this thesis, carbon nanotubes and graphene have been explored for application both as thermal interface materials and electrical conductors intended for microelectronic devices. By evaluating fabrication considerations, performance and reliability of these materials, new routes are outlined for the next generation of 3D electronic packages.
NANO components for electronic SMART wireless systems
European Commission (EC), 2019-01-01 -- 2021-12-31.
Carbon Based High Speed 3D GaN Electronics System
Swedish Foundation for Strategic Research (SSF), 2014-03-01 -- 2019-06-30.
Pilot line production of functionalized CNTs as thermal interface material for heat dissipation in electronics applications (SMARTHERM)
European Commission (EC), 2016-01-01 -- 2018-12-31.
Areas of Advance
Doktorsavhandlingar vid Chalmers tekniska högskola. Ny serie: 4907
Chalmers University of Technology
Online - Passcode: 823896
Opponent: Prof. Jinbo Bai, Department of Mechanical Civil Engineering Ecole CentraleSupelec, Paris-Saclay Universiy, France