Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy

Yulai Gao; Changdong Zou; Bin Yang; Qijie Zhai; Johan Liu; Evgeny Zhuravlev; Christoph Schick

Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Journal article, 2009

Author

Yulai Gao

Changdong Zou

Bin Yang

Other publications Research

Qijie Zhai

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Evgeny Zhuravlev

Christoph Schick

Journal of Alloys and Compounds

0925-8388 (ISSN)

Vol. 484 1-2 777-781

Subject Categories

Materials Engineering

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Created

10/8/2017

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