Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy
Journal article, 2009

Author

Yulai Gao

Changdong Zou

Qijie Zhai

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Evgeny Zhuravlev

Christoph Schick

Journal of Alloys and Compounds

0925-8388 (ISSN)

Vol. 484 1-2 777-781

Subject Categories

Materials Engineering

More information

Created

10/8/2017