Effect of Fiber Concentration on Mechanical and Thermal Properties of a Solder Matrix Fiber Composite Thermal Interface Material
Journal article, 2019

Increased demand on the mechanical and thermal properties on the thermal interface and die attach material creates a demand for materials with tailored material properties. Solder matrix fiber composites (SMFCs) have been shown to address these challenges, but have, so far, required complicated procedures and components. In this paper, we present the fabrication of a new type of SMFC based on commercially available fiber networks infiltrated with Sn-Ag-Cu alloy (SAC305) or indium using equipment for large-volume production. The composite material exhibits similar thermal properties compared to pure solder, and mechanical properties that can be tailored toward specific applications. We also show that the handling properties of the SMFC allows it to be used in process flows where multiple reflow cycles are required and can achieve a well-defined bond line thickness (BLT) and good bonding using fluxless reflow under pressure.

thermal management

Bond line thickness (BLT) control

thermal interface materials (TIMs)

solder

die attach

Author

Josef Hansson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Torbjörn Nilsson

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

IEEE Transactions on Components, Packaging and Manufacturing Technology

2156-3950 (ISSN)

Vol. 9 6 1045-1053 8701667

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Areas of Advance

Production

Subject Categories

Polymer Technologies

Textile, Rubber and Polymeric Materials

Composite Science and Engineering

DOI

10.1109/TCPMT.2019.2913690

More information

Latest update

7/15/2019