Högdensitets AI-infrastuktur för 6G system
Research Project, 2025
– 2028
The project aims to address cooling problems in large data centers and has a clear focus on sustainability and energy efficiency.
Participants
Johan Liu (contact)
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Collaborations
ABB
Zurich, Switzerland
APR Technologies AB
Enköping, Sweden
Enoc System AB
Anderstorp, Sweden
Ericsson
Stockholm, Sweden
Hitachi
Tokyo, Japan
Luleå University of Technology
Luleå, Sweden
Perstorp AB
Malmö, Sweden
RISE Research Institutes of Sweden
Göteborg, Sweden
SHT Smart High-Tech
Göteborg, Sweden
Funding
VINNOVA
Project ID: 2025-01032
Funding Chalmers participation during 2025–2028
Related Areas of Advance and Infrastructure
Information and Communication Technology
Areas of Advance