Chip scale micro liquid cooling for high dissipative packaging

Research Project, 2018 – 2019

A concept for effective direct cooling of heat generating electronics has been analyzed. The solution is based on APR Technologies unique heat management solution incl. miniaturized pumps, and offers enhanced design flexibility and higher performance. Cost reduction is foreseen. The opportunity to improve the heat transfer with aid of graphene-based layers has been evaluated. The IP landscape has been laid out.Three goal applications and their respective requirements have been identified and three global end-users included in a following proposal.

A thorough analysis of possible technologies for chip scale cooling has been made. A project proposal for a subsequent FoI /Demonstrator project has been prepared. A number of potential prospects have been contacted. Three global end-users will participate in the proposed FoI project. An IP search has been made and there is freedom-to-operate. A number of interesting graphene materials have been identified: graphene/TIM coatings, graphene foam and sprayed graphene. The strategy is to try to choose near-commercial, mature materials.