Highly Thermally Conductive and Light Weight Copper/Graphene Film Laminated composites for Cooling Applications
Paper in proceeding, 2018
Graphene film
Light-weight
Thermal resistance
Lamination
Author
Nan Wang
SHT Smart High-Tech
Shujing Chen
Shanghai University
Amos Nkansah
SHT Smart High-Tech
Christian Chandra Darmawan
SHT Smart High-Tech
Lilei Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)
1588-1592
978-1-5386-6386-8 (ISBN)
Shanghai, China,
Carbon Based High Speed 3D GaN Electronics System
Swedish Foundation for Strategic Research (SSF) (SE13-0061), 2014-03-01 -- 2019-06-30.
Subject Categories
Manufacturing, Surface and Joining Technology
Materials Chemistry
Other Materials Engineering
DOI
10.1109/ICEPT.2018.8480614
ISBN
9781538663868