1. Thermal Characterization of Power Devices Using Graphene-based Film
Paper in proceedings, 2014

Due to its atomic structure with sp2 hybrid orbitals and unique electronic properties, graphene has an extraordinarily high thermal conductivity which has been reported to be up to 5000 W/mK. As a consequence, the use of graphene-based materials for thermal management has been subject to substantial attention during recent years in both academia and industry. In this paper, the development of a new type of graphene-based thin film for heat dissipation in power devices is presented. The surface of the developed graphene based film is primarily composed of functionalized graphene oxide, that can be bonded chemically to the device surface and thus minimize the interface thermal resistance caused by surface roughness. A very high in-plane thermal conductivity with a maximum value of 1600 W/mK was detected by laser flash machine regarding to the graphene-based films. To investigate the structure of the graphene-based films, scanning electron microscopy (SEM) and raman spectroscopy were carried out. Finally, LED demonstrators were built to illustrate the thermal performance of graphene-based film and the functional layers. IR camera recorded a 5°C lower temperature of a LED demonstrator with SHT G1000 as the binding layer instead of a commercial thermal conductive adhesive.

Author

Johan Liu

SMIT Ltd. Co.

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Pengtu Zhang

East China University of Science and Technology

Chalmers, Microtechnology and Nanoscience (MC2)

Nan Wang

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Carl Zandén

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Lilei Ye

Smart High Tech AB

Yifeng Fu

Smart High Tech AB

2014 Electronic Components & Technology Conference

459 - 463

Subject Categories

Materials Engineering

DOI

10.1109/ECTC.2014.6897324

ISBN

978-1-4799-2407-3

More information

Latest update

12/27/2018