The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
Journal article, 2008

Author

Guo-Kui Ju

Xi-cheng Wei

Peng Sun

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Soldering & Surface Mount Technology

0945-0911 (ISSN)

Vol. 20 3 4-10

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017