The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

Guo-Kui Ju; Xi-cheng Wei; Peng Sun; Johan Liu

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths
Journal article, 2008

Author

Guo-Kui Ju

Xi-cheng Wei

Peng Sun

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

Other publications Research

Soldering and Surface Mount Technology

0954-0911 (ISSN) 17586836 (eISSN)

Vol. 20 3 4-10

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Latest update

9/7/2020 8

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The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths Journal article, 2008