Peng Sun

Publications (16)
Projects (0)

Showing 16 publications

2009

Thermal cycling of lead-free Sn-3.8Ag-0.7Cu 388PBGA packages

Cristina Andersson, B. Vandevelde, C. Noritake et al

Soldering and Surface Mount Technology. Vol. 21 (2), p. 28-38

Journal article

2009

Coffin-Mansson equation of Sn-4.0Ag-0.5Cu solder joint

S. Chen, Peng Sun, Xi-cheng Wei et al

Soldering and Surface Mount Technology. Vol. 21 (2), p. 48-54

Journal article

2008

Tensile properties and microstructural characterization of Sn-0.7Cu-0.4Co bulk solder alloy for electronics applications

Cristina Andersson, Peng Sun, Johan Liu

Journal of Alloys and Compounds. Vol. 457 (1/2), p. 97-105

Journal article

2008

The Comparison studies on growth kinetic of IMC of Cu/Sn3.0Ag0.5Cu (Sn0.4Co0.7Cu) joints during isothermal aging and their tensile strengths

Guo-Kui Ju, Xi-cheng Wei, Peng Sun et al

Soldering and Surface Mount Technology. Vol. 20 (3), p. 4-10

Journal article

2007

Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper

Johan Liu, Peng Sun

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Paper in proceeding

2007

Interfacial Reactions and Low Cycle Fatigue of Lead-Free Solders for Electronic Packaging

Peng Sun

Doctoral thesis

2006

High temperature aging study of intermetallic compound formation of Sn-3,5Ag and Sn-4.0Ag-0,5Cu solders on electroless Ni(P) metallization

Peng Sun, Cristina Andersson, Xi-cheng Wei et al

Journal of Alloys and Compounds. Vol. 425 (1-2), p. 191-199

Journal article

2006

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization

Peng Sun

Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA

Paper in proceeding

2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun, Cristina Andersson, Xicheng Wei et al

Materials Science & Engineering B: Solid-State Materials for Advanced Technology. Vol. 135 (2), p. 134-140

Journal article

2006

Coffin-Manson constant determination for a Sn-8Zn-3Bi Lead-Free Solder Joint

C. Bailey, Peng Sun, Xicheng Wei et al

Soldering and Surface Mount Technology. Vol. 18 (2), p. 4-11

Journal article

2006

Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal cycling testing

Peng Sun

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China

Paper in proceeding

2006

Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering

Peng Sun

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Paper in proceeding

2005

Low cycle fatigue testing and simulation of Sn8Zn-3Bi and Sn-37Pb solder joints

Peng Sun, Cristina Andersson, Xicheng Wei et al

Soldering and surface Mount Technology. Vol. 17 (4), p. pp38-45

Journal article

2005

Determination of Mason-Coffin equation for Sn-Zn based lead-free solder joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp342-347

Paper in proceeding

2005

Isothermal Low Cycle Fatigue Behavior of Single Shear Sn-9Zn and Sn-8Zn-3Bi Solder Joint

Peng Sun, Cristina Andersson, Zhaonian Cheng et al

Proceedings of the IEEE CPMT Conference on Electronics Component Technology (ECTC55), p. 696-700

Paper in proceeding

2005

Microstructural evolution of Sn-Zn based lead-free solders after exposure to temperature and humidity

Peng Sun, Cristina Andersson, Zonghe Lai et al

Proceedings of the 7th International IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP05), p. pp197-202

Paper in proceeding

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