High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper in proceeding, 2006
Author
Peng Sun
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA
Subject Categories
Other Materials Engineering