High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper i proceeding, 2006

Författare

Peng Sun

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA

Ämneskategorier

Annan materialteknik

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Skapat

2017-10-07