High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-P metallization
Paper i proceeding, 2006
Författare
Peng Sun
Chalmers, Mikroteknologi och nanovetenskap, Fasta tillståndets elektronik
Proceedings of the 56th IEEE CPMT International Conference on Electronic Components and Technology Conference (ECTC’06), San Diego, California, USA
Ämneskategorier
Annan materialteknik