Evolution of intermetallic compounds in PBGA Sn-Ag-Cu solder joints during thermal cycling testing
Paper in proceedings, 2006

Author

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the 2006 7th International Conference on Electronics Packaging Technology, Shanghai, China

Subject Categories

Other Materials Engineering

More information

Created

10/6/2017