Tensile fracture behaviour of Sn-3.0Ag-0.5Cu solder joints on copper
Paper in proceeding, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2)

Other publications Research

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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Created

10/6/2017

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