Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
Paper in proceedings, 2006

Author

Peng Sun

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Subject Categories

Other Materials Engineering

More information

Created

10/6/2017