Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
Paper in proceeding, 2006
Author
Peng Sun
Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China
Subject Categories (SSIF 2011)
Other Materials Engineering