Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish After Reflow Soldering
Paper i proceeding, 2006

Författare

Peng Sun

Chalmers, Mikroteknologi och nanovetenskap (MC2), Fasta tillståndets elektronik

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06), Shanghai, China

Ämneskategorier

Annan materialteknik