Thick film patterning by lift-off process using double-coated single photoresists
Journal article, 2012

A novel method using lift-off process for patterning very thick materials is developed and demonstrated. Unlike conventional lift-off processes, no special lift-off resist is used in this method. Instead, only a double-coated single photoresist is needed. Demonstrations using two commercial photoresists show that good patterning morphology and obvious undercuts as high as 15 mu m are obtained for lift-off, which is very difficult to achieve by existing methods. The application and feasibility of this approach is demonstrated by a carbon nanotube transfer process. This simple and effective method offers wider option to pattern very thick materials in high quality which are in strong demands.

Double-coated photoresist

Thick film deposition

mems

scale

transducer

Lift-off

deposition

low-temperature

Author

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

L. Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems Laboratory

Materials Letters

0167-577X (ISSN)

Vol. 76 117-119

Subject Categories

Physical Sciences

DOI

10.1016/j.matlet.2012.02.027

More information

Latest update

3/7/2018 7