Consequential toxicity assessment of the global shift to Pb free solder paste
Paper in proceedings, 2006

Author

Anders Andrae

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the International Conference on Electronic Packaging (ICEP 2006)

298-303

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017