Panel-Size Component Integration (PCI) with Molded Liquid Crystal Polymer (LCP) Substrates
Paper in proceeding, 2002
Author
J. Kivilahti
Johan Liu
Department of Microelectronics and Nanoscience
J. E. Morris
T. Suga
C. P. Wong
ECTC´02
955-961
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering