3D computational fluid dynamics simulation of carbon nanotube based microchannel on-chip cooler
Paper in proceeding, 2010

Cooling of microsystem electronic device is of great importance, according to increased heat dissipation based on Moore's law. Different solutions are proposed to overcome this issue. On-chip microchannel cooler implements micro-fabrication techniques to achieve large areas in small volume size by introducing micro channel CNT fins with smaller fin pitch. In this paper, a 3D model of this structure is simulated using computational fluid dynamics (CFD) in ANSYS® software, and effect of various parameters such as channel width and height is discussed to achieve an optimized cooling for this system.

Computational fluid dynamics

Electronics cooling

Carbon nanotubes

Flip chip packaging


N. Nabiollahi

Yifeng Fu

Chalmers, Applied Physics, Electronics Material and Systems

Johan Liu

Chalmers, Applied Physics, Electronics Material and Systems

IMAPS Nordic Annual Conference 2010, Proceedings

978-161782190-5 (ISBN)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering



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