Graphene-CNT hybrid material as potential thermal solution in electronics applications
Paper in proceeding, 2017
Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.
Thermal Conductivity
Graphene
CNT
Thermal Management
Covalent bonding
Author
C. C. Darmawan
SHT Smart High-Tech
L. Ye
SHT Smart High-Tech
Majid Kabiri Samani
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Yifeng Fu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
190-193
978-1-5386-3055-6 (ISBN)
IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Göteborg, Sweden,
Göteborg, Sweden,
Subject Categories
Materials Chemistry
DOI
10.1109/NORDPAC.2017.7993191