Graphene-CNT hybrid material as potential thermal solution in electronics applications
Paper in proceedings, 2017

Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating 1D CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.

Thermal Conductivity

Graphene

CNT

Thermal Management

Covalent bonding

Author

C. C. Darmawan

SHT Smart High-Tech

L. Ye

SHT Smart High-Tech

Majid Kabiri Samani

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Yifeng Fu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

Shanghai University

2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)

190-193

IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Göteborg, Sweden,

Subject Categories

Materials Chemistry

DOI

10.1109/NORDPAC.2017.7993191

More information

Latest update

3/7/2018 2