On the heat transfer enhancement based on micro-scale air impingingment jets with microstructure heat sink in electronics cooling
Paper in proceedings, 2006

A conceptual heat transfer enhancement scheme in electronic cooling is analyzed on the basis of micro-scale impinging jet array with microstructure heat sink. The cooling performance of the micro impinging jet array is discussed and compared with that of conventional large-scale jet impingement cooling, and the pressure drop due to the induced crossflow is a vital factor for the former. The primary mechanisms by which the different types of the microstructure heat sinks affect the heat transfer rate as well as the pressure drop for the micro impinging jet array are empirically analyzed and discussed. In any case, it is necessary to make a proper compromise between the enhanced heat transfer rate and the acceptable pressure drop for the removal of high chip heat fluxes by combining the micro impinging jet array with micro-structured surface.


Jingyu Fan

Shanghai University

Yan Zhang

Shanghai University


Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Solid State Electronics

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06; Shanghai; China; 27 June 2006 through 28 June 2006

978-142440488-9 (ISBN)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering



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