Microwave Cure of Metal-filled Electrically Conductive Adhesives
Paper in proceedings, 2001

Author

Tiebing Wang

Ying Fu

Matthias Becker

Johan Liu

Department of Microelectronics and Nanoscience

ECTC 51th

593-597

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017