Mechanical properties of a novel multi-scale silver paste for electronics interconnect application
Paper in proceeding, 2019

A novel nano-silver paste with characteristics of sintering at low temperature and operating at high temperature is one of the most promising interconnect materials in the semiconductor industry. This study focuses on the shear strength of sintered multi-scale silver paste synthesized by nano-silver particles, micro-silver particles and submicron silicon carbide particles coated with Ag (SCA). The silver paste was sintered at 250 °C without pressure. The shear strength reaches 9.22 MPa, with 64 wt.% nano-silver particles, 16.5 wt.% micro-silver particles and 1.5 wt.% SCA, respectively. With this, it shows great potential for high power electronics interconnect and cooing applications.

Electronics packaging

SCA particles

High power electronics


Shear strength

Sintered carbides

Silver paste

Silicon carbide

Semiconductor device manufacture

Mechanical properties


Yongqian Sun

Shanghai University

Xiuzhen Lu

Shanghai University

Q. Zhang

Shanghai University

Xiao Xin Zhang

Shanghai University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

L. Ye

SHT Smart High-Tech

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019

978-172815064-2 (ISBN)

20th International Conference on Electronic Packaging Technology, ICEPT 2019
Hong Kong, China,

Subject Categories


Materials Chemistry

Electrical Engineering, Electronic Engineering, Information Engineering



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