Finite Element Analysis to the Constitutive Behavior of Sintered Silver Nanoparticles Under Nanoindentation
Journal article, 2018

Finite element (FE) simulation is adopted as a fundamental tool to evaluate the mechanical reliability of packaging structures for electronic devices. Nevertheless, the determination of mechanical properties of sintered silver nanoparticles (AgNP) remains challenging as the traditional tensile test is difficult to be performed at a limited size. In the current study, spherical nanoindentation is utilized to measure the applied load-penetration depth responses of sintered AgNP reinforced by SiC microparticles at various weight ratios (0.0, 0.5, 1.0 and 1.5 wt.%). To describe the elasto-plastic behavior of this heterogeneous material, FE analysis is performed to simulate the indentation behavior and determine the parameters in the modified power-law model by fitting the average applied load-penetration depth responses. To overcome the uniqueness problem, the Young's modulus is directly determined by continuous stiffness measurement technique and the proposed constitutive model can provide a reasonably accurate mechanical estimation of sintered AgNP. The effect of SiC content on sintered AgNP is discussed by correlating the morphology observed by scanning electron microscope (SEM) and the constitutive parameters obtained from the FE simulations.

SiC microparticle

finite element analysis

constitutive model


Sintered silver nanoparticle


Xu Long

Northwestern Polytechnical University

Chongyang Du

Northwestern Polytechnical University

Zhen Li

Northwestern Polytechnical University

Hongcun Guo

Northwestern Polytechnical University

Yao Yao

Northwestern Polytechnical University

Xiuzhen Lu

Shanghai University

Xiaowu Hu

Nanchang University

Lilei Ye

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

International Journal of Applied Mechanics

1758-8251 (ISSN) 1758-826X (eISSN)

Vol. 10 10 1850110

Subject Categories

Applied Mechanics

Composite Science and Engineering

Other Electrical Engineering, Electronic Engineering, Information Engineering



More information

Latest update

4/3/2019 2