Heat Transfer Modeling of System in Package (SIP)
Paper in proceedings, 2000

Author

Jiemin Zhou

Xitao Wang

Liu Chen

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the Third International Symposium on High Density Packaging and Failure Analysis

107-125

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017