Sintering of SiC enhanced copper paste for high power applications
Paper in proceeding, 2017
nanoparticle
thermal characterization
Copper
TIM
sintering
heat management
Author
Martí Gutierrez
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Nan Wang
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Majid Kabiri Samani
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
L. Ye
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
151-156
978-1-5386-3055-6 (ISBN)
Göteborg, Sweden,
Subject Categories
Ceramics
DOI
10.1109/NORDPAC.2017.7993183