Reliability characterisation of lead free solder joints using three point bending test
Paper in proceedings, 2007

Author

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration (HDP´07)

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017