Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes
Paper in proceedings, 2002

Author

Liqiang Cao

Shiming Li

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP)

272-277

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017