Formulation and electrical and mechanical properties of anisotropic conductive adhesive pastes
Paper in proceeding, 2002


Liqiang Cao

Johan Liu

Department of Microelectronics and Nanoscience

Proceedings of the 2002 Internatinal Conference on Electronics Packaging (2002 ICEP)


Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

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5/6/2019 9