Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Paper in proceedings, 2006

Author

Bo Zhang

Vignesh Murugesan

Niklas Billström

Patrik Stenquist

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2)

Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06)

325-328

Subject Categories

Electrical Engineering, Electronic Engineering, Information Engineering

More information

Created

10/6/2017