Analysis of Mechanical Strength for Flip-chip Bonding of GaAs MMIC
Paper in proceeding, 2006
Author
Bo Zhang
Vignesh Murugesan
Niklas Billström
Patrik Stenquist
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2)
Proceedings of the eight IEEE CPMT International Symposium on High Density Packaging and Component Failure Anlaysis (HDP´06)
325-328
Subject Categories
Electrical Engineering, Electronic Engineering, Information Engineering