Computational Modelling of the Anisotropic Conductive Adhesive Assembly Process
Paper in proceeding, 2001
Author
D. C. Whalley
G. Glinsky
C.J. Bailey
Johan Liu
Department of Microelectronics and Nanoscience
Proceedings of the 3rd International Symposium on Electronics Materials and Packaging
393-398
Subject Categories (SSIF 2011)
Electrical Engineering, Electronic Engineering, Information Engineering