A Novel Graphene and Titanium Laminated Composite Film for Electronics Cooling Applications
Paper in proceeding, 2024
With the pursuit of electronics product performance, the thermal management of electronics devices is becoming increasingly prominent. It is well-known that graphene film (GF) has very good heat dissipation properties, while metal materials have excellent mechanical properties and anti-aging properties. If they are prepared into laminated materials, which can be used as the shell of heat pipes, vapor chambers and other heat dissipation devices to improve heat dissipation capacity. In this study, we developed a set of new GF/metal laminates and fabricated a new type of lightweight and high thermal conductivity GF/Ti laminated material with an out-plane thermal conductivity of 8.64 Wm−1K−1,.
Graphene films
Electronics cooling
Cooling applications
Electronics devices
Graphenes
Thermal
Titania
Product performance
Laminated materials
Electronics products
Author
Yuxaun Fang
Shanghai Polytechnic University
Lijie He
SHT Smart High-Tech
Yuanyuan Wang
SHT Smart High-Tech
Jin Chen
Shanghai Ruixi New Material High-Tech Ltd
Anders Ekholm
SHT Smart High-Tech
Xinfeng Wu
Shanghai Polytechnic University
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024
630-633
9798331522001 (ISBN)
26th Electronics Packaging Technology Conference, EPTC 2024
Singapore, Singapore,
Singapore, Singapore,
Subject Categories (SSIF 2025)
Nano-technology
DOI
10.1109/EPTC62800.2024.10909904