Jin Chen

Showing 11 publications

2024

A Simulation Based Comparative Study on Thermal and Mechanical Performance of Silicone Grease and Graphene-enhanced Thermal Pad for Single-chip and Multi-chip Packaging Applications

Jiabin Chen, Yunzheng Xuan, Yiran Liu et al
NordPac 2024 - 60th Annual Microelectronics and Packaging Conference and Exhibition
Paper in proceeding
2024

Reliability of Graphene Enhanced Thermal Interface Material under Mechanical Cycling

Kurban Yasin, Jin Chen, Johan Moller et al
2024 25th International Conference on Electronic Packaging Technology, ICEPT 2024
Paper in proceeding
2023

Toward ultrahigh thermal conductivity graphene films

Sihua Guo, Shujin Chen, Amos Nkansah et al
2D Materials. Vol. 10 (1)
Journal article
2023

A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications

Zhiyang Shen, Hongfeng Zhang, Amos Nkansah et al
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
Paper in proceeding
2023

Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material

Sihua Guo, Kristoffer Harr Martinsen, Amos Nkansah et al
24th European Microelectronics and Packaging Conference, EMPC 2023
Paper in proceeding
2021

Characterization of Longitudinal Thermal Conductivity of Graphene Film

Jiajia Chen, Xinjian Gong, Sihua Guo et al
2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021
Paper in proceeding
2021

Fabrication and Characterization of Graphene/polyimide Composite Film

Xinjian Gong, Jin Chen, Yong Zhang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Graphene-based films: Fabrication, interfacial modification, and applications

Sihua Guo, Jin Chen, Yong Zhang et al
Nanomaterials. Vol. 11 (10)
Review article
2021

Synergistic Toughening of Graphene Films by Addition of Hydroxylated Carbon Nanotube

Sihua Guo, Jin Chen, Yuanyuan Wang et al
2021 23rd European Microelectronics and Packaging Conference and Exhibition, EMPC 2021
Paper in proceeding
2021

Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Ying Wang, Yuan Gao, Bo Tang et al
RSC Advances. Vol. 11 (41), p. 25422-25430
Journal article

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