Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material
Paper in proceeding, 2023
With the continuous development of electronic devices, effective heat dissipation has become a major factor affecting service life. Thermal interface materials (TIM) play a key role in controlling heat dissipation of electronic devices and have thus attracted widespread attention. In this study, we used graphene flakes (GF) derived from graphene film that is wasted during the preparation of commercial large-scale graphene-enhanced TIMs as thermally conductive fillers to formulate a new TIM. The thermal conductivity of the developed TIM is 50% higher with GFs than without. Furthermore, the TIM has a tensile strength of 0.46 MPa with an elongation at break of 1225%, a maximum compression strength of 0.64 MPa at 50% compression, and high mechanical cycle stability. This report provides a cost-efficient and environmentally friendly approach to producing high-performance TIMs for electronic cooling applications.
Graphene flakes
Thermal interface material
Environmentally friendly
Cost-efficient
Author
Sihua Guo
Shanghai University
Kristoffer Harr Martinsen
SHT Smart High-Tech
Amos Nkansah
SHT Smart High-Tech
Jiajia Chen
Shanghai University
Zhiyang Shen
SHT Smart High-Tech
Murali Murugesan
SHT Smart High-Tech
Hongfeng Zhang
SHT Smart High-Tech
Lars Almhem
SHT Smart High-Tech
Arto Ahtonen
SHT Smart High-Tech
Jin Chen
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai University
24th European Microelectronics and Packaging Conference, EMPC 2023
9780956808691 (ISBN)
24th European Microelectronics and Packaging Conference, EMPC 2023
Cambridge, United Kingdom,
Cambridge, United Kingdom,
Subject Categories
Materials Chemistry
Other Materials Engineering
DOI
10.23919/EMPC55870.2023.10418385