Characterization of a Novel Cost-efficient and Environmentally Friendly Graphene-enhanced Thermal Interface Material
Paper in proceeding, 2023

With the continuous development of electronic devices, effective heat dissipation has become a major factor affecting service life. Thermal interface materials (TIM) play a key role in controlling heat dissipation of electronic devices and have thus attracted widespread attention. In this study, we used graphene flakes (GF) derived from graphene film that is wasted during the preparation of commercial large-scale graphene-enhanced TIMs as thermally conductive fillers to formulate a new TIM. The thermal conductivity of the developed TIM is 50% higher with GFs than without. Furthermore, the TIM has a tensile strength of 0.46 MPa with an elongation at break of 1225%, a maximum compression strength of 0.64 MPa at 50% compression, and high mechanical cycle stability. This report provides a cost-efficient and environmentally friendly approach to producing high-performance TIMs for electronic cooling applications.

Graphene flakes

Thermal interface material

Environmentally friendly

Cost-efficient

Author

Sihua Guo

Shanghai University

Kristoffer Harr Martinsen

SHT Smart High-Tech

Amos Nkansah

SHT Smart High-Tech

Jiajia Chen

Shanghai University

Zhiyang Shen

SHT Smart High-Tech

Murali Murugesan

SHT Smart High-Tech

Hongfeng Zhang

SHT Smart High-Tech

Lars Almhem

SHT Smart High-Tech

Arto Ahtonen

SHT Smart High-Tech

Jin Chen

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Shanghai University

24th European Microelectronics and Packaging Conference, EMPC 2023


9780956808691 (ISBN)

24th European Microelectronics and Packaging Conference, EMPC 2023
Cambridge, United Kingdom,

Subject Categories

Materials Chemistry

Other Materials Engineering

DOI

10.23919/EMPC55870.2023.10418385

More information

Latest update

3/13/2024