A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications
Paper in proceeding, 2023
thermal performance
nanofluid
wick
heat pipe
Author
Zhiyang Shen
Shanghai University
Hongfeng Zhang
SHT Smart High-Tech
Amos Nkansah
SHT Smart High-Tech
Jiajia Chen
Shanghai University
Jin Chen
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Published in
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
9798350338812 (ISBN)
Conference
Shihezi City, China, 2023-08-07 - 2023-08-10
Categorizing
Subject Categories (SSIF 2011)
Energy Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
Identifiers
DOI
10.1109/ICEPT59018.2023.10492261