A Critical Assessment of graphene based heat pipes for electronics and power module cooling applications
Paper in proceeding, 2023
wick
nanofluid
thermal performance
heat pipe
Author
Zhiyang Shen
Shanghai University
Hongfeng Zhang
SHT Smart High-Tech
Amos Nkansah
SHT Smart High-Tech
Jiajia Chen
Shanghai University
Jin Chen
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
9798350338812 (ISBN)
Shihezi City, China,
Subject Categories
Energy Engineering
Other Electrical Engineering, Electronic Engineering, Information Engineering
DOI
10.1109/ICEPT59018.2023.10492261