Investigation of thermal interface materials reinforced with micro- and nanoparticles
Paper in proceedings, 2017

Heat management is one of the major challenges in modern electronic devices. The higher performance results in a production of greater amount of heat which needs to be efficiently dissipated so as to ensure the electronic devices operational during the period of lifetime. This paper discusses the application of micro- and nano-materials in thermal interface materials (TIM) used for heat management. Effects of type, size and geometry of different fillers were experimentally investigated. The results showed that it is recommended to utilize silver particles compared to copper ones to achieve higher heat dissipation. And the particles of smaller size may enhance the thermal conductivity of elaborated materials.


K. Janeczek

Instytut Tele-i Radiotechniczny, Warszawa

A. Arazna

Instytut Tele-i Radiotechniczny, Warszawa

Y. Zhang

Shanghai University

S. Ma

Shanghai University

J. Sitek

Instytut Tele-i Radiotechniczny, Warszawa

J. Fan

Shanghai University

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems Laboratory

K. Lipiec

Instytut Tele-i Radiotechniczny, Warszawa

China Semiconductor Technology International Conference 2017, CSTIC 2017

978-150906694-0 (ISBN)

Subject Categories

Energy Engineering

Areas of Advance






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