A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure
Paper in proceeding, 2022
The high contact thermal resistance of the interface between graphene films (GF) and substrates has become one of the key obstacles for the application of GF in electronic devices. A novel nano-Ag paste with nano-Ag particles modified reduced graphene oxide (Ag-rGO) was introduced to enhance the heat transport via the interface of GF and substrate. The influence of the content of Ag-rGO on shear strength and electrical resistivity of sintered Ag structure was investigated. The maximum shear strength and the minimum electrical resistivity were got for sintered Ag structure with 0.5 wt.% Ag-rGO. Reduced contact thermal resistance of GF and Cu substrate (GF/Cu) laminated structure was gained by using sintered Ag structure with Ag-rGO as interconnect materials. The minimum value of the thermal resistance of 2.02 ± 0.26 mm2·K/W was obtained for GF/Cu laminated structure connected by sintered Ag structure with 1 wt.% Ag-rGO.
thermal resistance
GF
shear strength
electrical resistivity
nano-sliver paste
Ag-rGO
Author
Chenfei Zhou
Shanghai University
Zheng Lv
Shanghai University
Xiuzhen Lu
Shanghai University
Amos Nkansah
SHT Smart High-Tech
Johan Liu
Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems
Shanghai Polytechnic University
2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022
9781665499057 (ISBN)
23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Dalian, China,
Dalian, China,
Subject Categories
Ceramics
Materials Chemistry
Other Materials Engineering
DOI
10.1109/ICEPT56209.2022.9873318