A novel nano-Ag paste with Ag-rGO and its application in GF/Cu laminated structure
Paper in proceeding, 2022

The high contact thermal resistance of the interface between graphene films (GF) and substrates has become one of the key obstacles for the application of GF in electronic devices. A novel nano-Ag paste with nano-Ag particles modified reduced graphene oxide (Ag-rGO) was introduced to enhance the heat transport via the interface of GF and substrate. The influence of the content of Ag-rGO on shear strength and electrical resistivity of sintered Ag structure was investigated. The maximum shear strength and the minimum electrical resistivity were got for sintered Ag structure with 0.5 wt.% Ag-rGO. Reduced contact thermal resistance of GF and Cu substrate (GF/Cu) laminated structure was gained by using sintered Ag structure with Ag-rGO as interconnect materials. The minimum value of the thermal resistance of 2.02 ± 0.26 mm2·K/W was obtained for GF/Cu laminated structure connected by sintered Ag structure with 1 wt.% Ag-rGO.

thermal resistance

GF

shear strength

electrical resistivity

nano-sliver paste

Ag-rGO

Author

Chenfei Zhou

Shanghai University

Zheng Lv

Shanghai University

Xiuzhen Lu

Shanghai University

Amos Nkansah

SHT Smart High-Tech

Johan Liu

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Shanghai Polytechnic University

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022


9781665499057 (ISBN)

23rd International Conference on Electronic Packaging Technology, ICEPT 2022
Dalian, China,

Subject Categories

Ceramics

Materials Chemistry

Other Materials Engineering

DOI

10.1109/ICEPT56209.2022.9873318

More information

Latest update

10/27/2023