Reduction of thermal resistance of Ag-coated GFs/copper structure using nano-Ag paste as interconnection
Paper in proceeding, 2022

Reduction of the thermal resistance between graphene films (GFs) and substrate is crucial to the application of GFs in thermal management. GFs/copper structures were prepared using nano-Ag paste as interconnection material. The effect of the thickness of nano-Ag paste on thermal resistance of GFs/copper structure was investigated. A thin layer of Ag was coated on GFs by physical vapor deposition (PVD) to further reduce thermal resistance. The thermal resistance of GFs/copper structure using Ag-coated GFs is 5.84% lower than that using raw GFs. The thermal resistance of GFs/copper structure decreases first and then increases with the increase of coating temperature and thickness of Ag layer. The minimum thermal resistance of 1.64 mm2·K·W-1 was gained for GFs/copper structure using GFs coated Ag at 300 ℃ for 60 min.

Author

Zhen Lv

Shanghai University

Chenfei Zhou

Shanghai University

Johan Liu

Shanghai University

Chalmers, Microtechnology and Nanoscience (MC2), Electronics Material and Systems

Xiuzhen Lu

Shanghai University

Journal of Physics: Conference Series

17426588 (ISSN) 17426596 (eISSN)

Vol. 2174 1 012061

9th International Conference on Advanced Manufacturing Technology and Materials Science, AMTMS 2021
Beijing, Virtual, China,

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Subject Categories

Inorganic Chemistry

Manufacturing, Surface and Joining Technology

Other Materials Engineering

DOI

10.1088/1742-6596/2174/1/012061

More information

Latest update

3/7/2022 9